Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1998-02-02
1999-11-30
Hiteshew, Felisa
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
117 84, 118723VE, 427 451, C23C 1434
Patent
active
059936142
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method and apparatus for manufacturing substrate with a thin film used as optical thin films for optical filters such as various band-pass filters, antireflection films of various displays, various thin films used in various semiconductors, optical discs, LCDs and color filters of LCDs, and also recently highlighted MgO films for PDPs, and various transparent electrodes such as ITO, SnO.sub.2, In.sub.2 O.sub.3 and ZnO films used in LCDs, touch panels, EC elements, heating mirrors, etc., for example, antireflection filters, antireflection optical filters to be mounted on the fronts of various displays such as CRTs (cathode ray tubes), LCDs (liquid crystal displays), ELs (electroluminescent displays), LEDs (light emitting diode displays), VFDs (fluorescent character display tubes), projection type displays, etc., antireflection films directly applied onto their display screens, antireflection films applied to polarizing films used in LCDs, interference filters, half mirrors, infrared cold mirrors and IR (infrared) cut filters used popularly for fiber light sources, liquid crystal projectors, motion picture projectors, dental illumination, shopping illumination, etc. respectively sensitive to harmful heat rays (infrared rays), UV (ultraviolet ray) cold mirrors and UV cut filters for exclusively reflecting ultraviolet rays 365, 405 and 436 nm (i ray, g ray and h ray) for the parabolic mirrors, ellipsoidal mirrors and plane mirrors used in semiconductors and liquid crystal displays, and dichroic filters and dichroic mirrors corresponding to R (red), G (green) and B (blue) used in color photographic development, color printers, color faxes, color television cameras and video projectors.
BACKGROUND ART
Films such as optical thin films for optical filters, antireflection films of various displays, and films of various substrate with a thin film used in various semiconductors, optical discs, LCDs, color filters, transparent electrodes, etc. are formed by vacuum evaporation, ion assisted evaporation, ion plating, sputtering, ablation, etc.
In reference to a case where an antireflection film is formed on an optical lens or where an optical thin film such as an antireflection film or optical filter is formed on a flat substrate such as a glass sheet or resin sheet by vacuum evaporation, the conventional method for manufacturing substrate with a thin film is described below in reference to drawings.
FIG. 4 is a typical view showing how such substrate with a thin film are produced. At first, a film forming chamber is described. Inside a vacuum chamber 16, a film material 3 is placed with its film forming particle generating region 2 turned upward in the drawing. An electron beam is emitted from an electron gun 6 to reach the film forming particle generating region 2 due to the effect of a magnetic field not illustrated, to heat the region 2, and as a result, film forming particles 5 are generated. The film forming particle flux axis 9 (directional axis to express the direction in which the film forming particles are generated most intensively) of the film forming particles 5 generated like this is turned upward in the drawing. On or near the axial line of the film forming particle flux axis 9, a film formation monitor 8 is installed, and a film thickness measuring instrument 7 for optically measuring the thickness of the film formed on the film formation monitor 8 is installed further above the monitor 8. To allow the film forming particles to reach the film formation monitor 8, a hole 401 is formed at the center of a domed substrate holder 402. The domed substrate holder 402 can rotate on a horizontal plane above the film forming particle generation source, so that the under surfaces of the substrates on which a film to be formed 403 fixed in the domed substrate holder 402 may be exposed to the film forming particles, to form a film on each of them. Furthermore, to limit the range in which the substrates on which a film to be formed 403 are exposed to the film form
REFERENCES:
patent: 4859493 (1989-08-01), Lemelson
patent: 5250660 (1993-10-01), Shuman
patent: 5340454 (1994-08-01), Schaefer et al.
patent: 5474611 (1995-12-01), Murayama et al.
patent: 5707500 (1998-01-01), Shimamura et al.
Hiteshew Felisa
Toray Industries Inc.
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