Process for producing leadframe material for semiconductor

Details Process for producing leadframe material for semiconductor Process for producing leadframe material for semiconductor

1992-03-11

1994-10-11

Chaudhuri, Olik

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437220, 156666, C23F 102

Patent

active

053544226

ABSTRACT:
A process for producing a leadframe for a semiconductor including (i) providing nickel or nickel-base alloy plating layers on both sides of a base material including an iron-base material or a copper-base material by electroplating or chemical plating so as to have a single layer thickness in the range of from 3 to 20 microns, (ii) applying a photoresist on both sides of the leadframe material produced in step (i) and forming a leadframe pattern by a patterning process and (iii) subjecting the leadframe material patterned in step (ii) to etching.

REFERENCES:
patent: 4711700 (1987-12-01), Cusack
patent: 4888449 (1989-12-01), Crane et al.
patent: 5116458 (1992-05-01), Grabble

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