Semiconductor device

Details Semiconductor device Semiconductor device

1990-04-02

1991-05-14

James, Andrew J.

Fishing, trapping, and vermin destroying

357 81, 437211, 437224, H05K 720, H01L 2330

Patent

active

050160842

ABSTRACT:
A semiconductor device is provided with an electrically conductive cap having a sufficiently thick edge portion for preventing warpage due to the hardening of an encapsulating resin. Since the edge portion of the conductive cap is formed into the shape of a frame, and its thickness is made large, the mechanical strength of the conductive cap is improved, so that even when stress is applied to the conductive cap owing to the hardening of the encapsulating resin, the conductive cap is unlikely to undergo deformation, thereby preventing the warping of the semiconductor device.

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patent: 4330790 (1982-05-01), Burns
patent: 4392151 (1983-07-01), Iwatani
patent: 4633573 (1987-01-01), Scherer
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4701999 (1987-10-01), Palmer
patent: 4829403 (1989-05-01), Harding
Michael Lancaster, "Tape Automated . . . Density?", Nepcon West, 1987, pp. 503-515.
Thomas A. Scharr, "Tab Bonding . . . Die", ISHM, 1983, pp. 561-565.

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