Resin sealing and molding apparatus for sealing electronic parts

Details Resin sealing and molding apparatus for sealing electronic parts Resin sealing and molding apparatus for sealing electronic parts

1996-10-25

1998-07-21

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425225, 425227, 425229, 4251744, 264 39, B29C 4514, B29C 4517

Patent

active

057832200

ABSTRACT:
A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

REFERENCES:
patent: 3690801 (1972-09-01), Hutz et al.
patent: 3801251 (1974-04-01), Coscia
patent: 3941537 (1976-03-01), Abraham
patent: 4983115 (1991-01-01), Yamasaki et al.

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