Process of producing multiple-layer glass-ceramic circuit board

Details Process of producing multiple-layer glass-ceramic circuit board Process of producing multiple-layer glass-ceramic circuit board

1992-06-08

1994-02-22

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

427 97, H01K 310

Patent

active

052876209

ABSTRACT:
A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

REFERENCES:
patent: 4599277 (1986-07-01), Brownlow et al.

Affiliated with

Also associated with

Rating

Process of producing multiple-layer glass-ceramic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing multiple-layer glass-ceramic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing multiple-layer glass-ceramic circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-163870