Compact process chamber for improved process uniformity

Details Compact process chamber for improved process uniformity Compact process chamber for improved process uniformity

1998-11-19

2000-11-07

Jones, Deborah

Coating apparatus

Gas or vapor deposition

118728, 118729, 118620, 118641, C23C 1600

Patent

active

06143079&

ABSTRACT:
A semiconductor processing chamber, capable of withstanding low pressures while transmitting radiant energy, is provided in a lightweight, compact design. The inner surface of the window is preferably substantially flat and parallel to the wafer to be processed. The window is thin in a center portion and thicker in a surrounding peripheral portion. The thickness increases in the radially outward direction, defined between the flat inner surface and a concave outer surface. Deposition uniformity is improved by employing multiple outlet ports for distributing gas laterally in a short length, enabling a compact, symmetrical geometry. Preferably, a quadra-flow system of gas distribution is used, whereby the chamber contains one inlet port and three outlet ports distributed approximately at 90 degrees around a cylindrical side wall defining the chamber space.

REFERENCES:
patent: 4793283 (1988-12-01), Sarkozy
patent: 4821674 (1989-04-01), DeBoer et al.
patent: 4920918 (1990-05-01), Adams et al.
patent: 4958061 (1990-09-01), Wakabayashi et al.
patent: 5033407 (1991-07-01), Mizuno et al.
patent: 5085887 (1992-02-01), Adams et al.
patent: 5108792 (1992-04-01), Anderson et al.
patent: 5221556 (1993-06-01), Hawkins et al.
patent: 5250323 (1993-10-01), Miyazaki
patent: 5269847 (1993-12-01), Anderson et al.
patent: 5573566 (1996-11-01), Anderberg et al.
patent: 5582866 (1996-12-01), White
patent: 5641358 (1997-06-01), Stewart

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