Process for preparing printed circuits

Details Process for preparing printed circuits Process for preparing printed circuits

1986-12-23

1988-02-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156233, 156249, 156631, 156633, 156655, 156667, 156902, 29846, 174 685, 428601, 428632, 428674, B44C 122, C03C 1500, C03C 2506

Patent

active

047227656

ABSTRACT:
The present invention describes an improved reverse lamination process for reparing printed circuits with resistors, conductor strips and/or contacts integrated in the circuit. A separating layer is applied on a metallic intermediate carrier. The intermediate carrier thus coated is then printed with a conductive paste in a desired. mirror-inverted layout to provide the resistors, conductor strips and/or contacts. This is followed by the lamination which is carried out under temperature effect and under pressure, the thus laminated package comprising the intermediate carrier, an intermediate layer and the final substrate. The intermediate carrier is subsequently removed, and the separating layer is etched off. The separating layer acts as a parting agent to permit easy mechanical separation and reuse of the metallic intermediate carrier.

REFERENCES:
patent: 3181986 (1965-05-01), Pritikin
patent: 3324014 (1967-06-01), Modjeska
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4383003 (1983-05-01), Lifshin et al.
patent: 4394419 (1983-07-01), Konicek
patent: 4431710 (1984-02-01), Lifshin et al.

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