Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1999-05-12

2000-11-07

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 9, 228 24, 228 443, 228 491, B23K 3700, B23K 114, B23K 3704, B23K 100, B23K 500, B23K 2000, B23Q 1500, B23Q 1600

Patent

active

061423564

ABSTRACT:
An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

REFERENCES:
patent: 3646304 (1972-02-01), Dallet et al.
patent: 4257061 (1981-03-01), Chapel, Jr. et al.
patent: 4749329 (1988-06-01), Stout
patent: 4804810 (1989-02-01), Drummond et al.
patent: 5634267 (1997-06-01), Farnworth et al.

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