4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Plural discrete workpieces

Terumitsu Santo

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Die bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent

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Semiconductor laser device and wire bonding method capable...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Semiconductor laser device and wire bonding method capable...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1583502

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