Method for forming semiconductor thin film

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437108, 437966, 437973, 437173, 148DIG1, 148DIG154, H01L 2120

Patent

active

052780937

ABSTRACT:
A method for forming a semiconductor thin film comprises crystallizing an amorphous silicon thin film by a first thermal treatment at 700.degree. C. or lower for ten hours or longer and carrying out a second thermal treatment at 1200.degree. C. or higher in which a lamp light is radiated to the crystallized thin film.

REFERENCES:
patent: 4331485 (1982-05-01), Gat
patent: 4356384 (1982-10-01), Gat
patent: 4617066 (1986-10-01), Vasuder
patent: 4621413 (1986-11-01), Lowe et al.
patent: 4752590 (1988-06-01), Adams et al.
patent: 4808546 (1989-02-01), Moniwa et al.
patent: 4814292 (1989-03-01), Sasuki et al.
patent: 4992846 (1991-02-01), Sakakibara et al.
"Crystal Defect Study of Solid Phase Epitaxially Grown Si Surrounded by SiO2 Structures," E. Murakami et al., Extended Abstracts of the 20th (1988 International) Conference on Solid State Devices and Materials, Tokyo, Aug. 24-26, 1988, pp. 185-188.
"Characterization of Solid-Phase Epitaxially-Grown Silicon Films on SiO2," M. Tamura et al., Japanese Journal of Applied Physics, vol. 23, No. 10, part 1, Oct. 1984, pp. 1294-1299.
"Two-beam laser recrystallization of polycrystalline silicon on an insulating substrate," S. Dasgupta et al., Journal of Applied Physics, Woodbury, N.Y., vol. 64, No. 4, Aug. 15, 1988, pp. 2069-2075.
"Crystallization of Amorphous Silicon Films Using a Multistep Thermal Annealing Process," E. Korin et al., Thin Solid Films, Lausanne, CH, vol. 167, No. 1, Dec. 15, 1988, pp. 101-106.
"Low-temperature SOI (Si-on-insulator) formation by lateral solid-phase epitaxy," M. Miyao et al., Journal of Applied Physics, Woodbury, N.Y., vol. 64, No. 6, Sep. 15, 1988, pp. 3018-3023.
"Polysilicon Super Thin Film Transistor Technology," T. Noguchi et al., Polysilicon Films and Interfaces, Materials Research Society Symposium Proceedings, vol. 106, pp. 293-305.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming semiconductor thin film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming semiconductor thin film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming semiconductor thin film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1630926

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.