Method of incorporating IC modules into identification cards

Details Method of incorporating IC modules into identification cards Method of incorporating IC modules into identification cards

1982-05-19

1984-07-03

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156268, 156289, 156293, 156344, B32B 3118

Patent

active

044577982

ABSTRACT:
A method of producing an identification card having an IC module arranged on a carrier element.
The carrier element is inserted into a recess in the card. The card has a multilayer construction and bears a separation layer between at least two card layers in the area intended to take up the carrier element. The card is produced by the usual reliable methods. The recess for the carrier element in the form of a punched or blind hole is created by punching through the edge of the portion of the card to be removed up to the separation layer, and removing the severed plug-like element along with the separation layer from the recess. The carrier element is finally stuck into the recess. The production of the recess in the finished card by means of a punching or cutting device can be carried out completely free of dust and chips.
The production of the identification card and the embedding of the IC module or carrier element are carried out independently of one another, so that the sensitive IC module is not subjected to the operational sequences of the production of the card.

REFERENCES:
patent: 3508754 (1970-04-01), Shorin

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