Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-13
1998-09-22
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174260, 257738, 257778, 361760, 361777, 361779, H01R 909, H05K 706
Patent
active
058123792
ABSTRACT:
A solder joint interface which includes a plurality of solder balls that attach an integrated circuit package to corresponding pads of a printed circuit board. The solder pads are on a 0.05 inch pitch and have a diameter of 0.02 inches so that two 0.006 inch routing traces can be routed between adjacent pads of the circuit board. The additional routing traces allow the solder pads to be arranged in a pattern that has five rows of solder pads. The solder balls have pre-assembled diameters of 0.030 inches and a final height of 0.02 inches. The relatively tall solder joints function as structural beams that undergo both shear and moment stresses when an external load is applied to the joints. The moment component produces lower solder stresses and improves the structural integrity of the solder joints.
REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), King et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 5641946 (1997-06-01), Shim
Intel Corporation
Sparks Donald
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