Semiconductor device with film carrier package structure

Details Semiconductor device with film carrier package structure Semiconductor device with film carrier package structure

1996-04-23

1998-09-22

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257668, 257706, 257707, H01L 23495, H01L 2310, H01L 2334

Patent

active

058118764

ABSTRACT:
A lead portion of a film carrier package is sandwiched between a slanted area of a radiation plate and a slanted area of a press frame. The radiation plate has the structures that the front surface thereof has the flat area at the central unit parallel to the back surface, and has at the peripheral portion the slanted area increasing or decreasing the thickness toward the outer periphery of the radiation plate. The film carrier package has the structures that a window is formed at the central area thereof, having a size smaller than the flat area, a slit is formed in an insulating film inside of the interconnection pattern by 1 to 5 mm, and the area surrounded by slits at the four sides is larger than the outer dimension of the radiation plate. The slanted area of the radiation plate engages with the slanted area of the press frame. The film carrier package with the radiation plate can be assembled in a short period while ensuring a low heat resistance.

REFERENCES:
patent: 5227663 (1993-07-01), Patil et al.
patent: 5386342 (1995-01-01), Rostoker
patent: 5561323 (1996-10-01), Andros et al.
Flat Package Using Three Layer Film, IBM TDB vol. 30, No. 8, Jan. 1989, p. 119.

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