Method of forming contact openings and an electronic component f

Details Method of forming contact openings and an electronic component f Method of forming contact openings and an electronic component f

1996-08-22

1998-09-22

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438618, H01L 2348

Patent

active

058113509

ABSTRACT:
A method for forming a contact opening is described and which includes providing a node location to which electrical connection is to be made; forming a conductive line adjacent the node location, the conductive line having a conductive top and sidewall surfaces; forming electrically insulative oxide in covering relation relative to the top surface of the conductive line; forming electrically insulative nitride sidewall spacers over the conductive sidewall surfaces, the nitride sidewall spacers projecting outwardly of the conductive line top conductive surface, the electrically insulative oxide positioned between the nitride sidewall spacers; forming an electrically insulative layer outwardly of the conductive line, and the node location; and etching a contact opening to the node location or the top surface through the electrically insulative layer substantially selective relative to the nitride sidewall spacers.

REFERENCES:
patent: 5166096 (1992-11-01), Cote et al.
patent: 5317193 (1994-05-01), Watanabe
patent: 5444003 (1995-08-01), Wang et al.
patent: 5547892 (1996-08-01), Wuu et al.
patent: 5576243 (1996-11-01), Wuu et al.
patent: 5612240 (1997-03-01), Chang
patent: 5652174 (1997-07-01), Wuu et al.

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