Process and apparatus for etching copper masked by a nickel-gold

Details Process and apparatus for etching copper masked by a nickel-gold Process and apparatus for etching copper masked by a nickel-gold

1984-05-17

1985-09-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156666, 156902, 156904, 156345, 20412965, 252 792, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045431531

ABSTRACT:
Process and apparatus for anisotropically etching copper through a nickel-gold mask on a circuit board. An electrical connection is made between the copper and the reactor wall or another electrical conductor contacted by the etching solution. The copper is removed anisotropically, without undercutting or lateral etching of the copper beneath the nickel-gold mask.

REFERENCES:
patent: 3287191 (1966-11-01), Borth
patent: 3905883 (1975-09-01), Hanazono et al.
patent: 4045312 (1977-08-01), Satoshi
patent: 4075757 (1978-02-01), Malm et al.

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