Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1986-10-21
1988-09-06
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430313, 430314, 430315, 430319, G03C 500
Patent
active
047693096
ABSTRACT:
A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.
The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material. A second board panel is also fabricated, having a raised electrically conducting second circuit pattern extending from a its base layer of conductive material and a raised electrically conducting third circuit pattern extending from the second circuit pattern. The first board panel is laminated to the second board panel with a laminate insulating material disposed therebetween electrically insulating the first circuit pattern from the second circuit pattern and with the third circuit pattern electrically contacting the first circuit pattern at selected portions thereof. Finally, the base layers of conductive material are removed from the laminate insulating material.
REFERENCES:
patent: 2961746 (1960-11-01), Lyman
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3977075 (1976-08-01), Lynch et al.
patent: 4088545 (1978-05-01), Supnet
patent: 4312897 (1982-01-01), Reimann
patent: 4393111 (1983-07-01), Klein
patent: 4414741 (1983-11-01), Holt
patent: 4432037 (1984-02-01), Brabetz
patent: 4495479 (1985-01-01), Hermann
patent: 4511757 (1985-04-01), Ors et al.
patent: 4532152 (1985-07-01), Elarde
patent: 4606787 (1986-08-01), Bellegrino
Decker Richard W.
King David R.
Lee Mark S.
Kittle John E.
Ryan Patrick J.
Sutcliff W. G.
Westinghouse Electric Corp.
LandOfFree
Printed circuit boards and method for manufacturing printed circ does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit boards and method for manufacturing printed circ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit boards and method for manufacturing printed circ will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1606539