Method for planarizing a semiconductor body by CMP method and an

Details Method for planarizing a semiconductor body by CMP method and an Method for planarizing a semiconductor body by CMP method and an

1995-12-27

1997-12-09

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 1566261, 1566451, 216 85, 216 88, 437228, H01L 21306

Patent

active

056956010

ABSTRACT:
A film formed on a wafer is polished in a CMP unit. Thereafter, the wafer, which is adhered to a wafer holder, is moved to a portion above an optical sensor. A surface of the wafer is radiated with, for example, a visible ray, thereby measuring a thickness of the film which has been polished. A control unit automatically sets a polishing time for polishing a film on a wafer to be polished next.

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