Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1995-05-30
1997-02-18
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257737, 257778, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
056043791
ABSTRACT:
A semiconductor device comprising a semiconductor chip, a plurality of electrode pads formed on the semiconductor chip, a metal wiring having a desired pattern and connected to the electrode pads, an anisotropic conductive film containing fine conductive particles and laminated on the semiconductor chip including the metal wiring, and an external electrode, in which the anisotropic conductive film has a concave portion at a desired portion on the metal wiring and the metal wiring is connected to the external electrode through the intermediary of the fine conductive particles present in the anisotropic conductive film by stuffing and sticking the external electrode in the concave portion.
REFERENCES:
patent: 4811081 (1989-03-01), Lyden
Jr. Carl Whitehead
Sharp Kabushiki Kaisha
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