Method for attaching a semiconductor die to a support

Details Method for attaching a semiconductor die to a support Method for attaching a semiconductor die to a support

1996-08-20

1997-08-12

Picardat, Kevin

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

438118, 257666, 156292, 156320, H01L 2160

Patent

active

056565518

ABSTRACT:
A method for attaching a semiconductor wafer section to a lead free comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.

REFERENCES:
patent: 5089439 (1992-02-01), Lippey
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.

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