Manufacturing method for semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438162, 438535, H01L 29786, H01L 21365, H01L 21385, H01L 21428

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active

056565119

ABSTRACT:
A manufacturing method for a semiconductor device is preferably used for a semiconductor device using SOI (Silicon on Insulation) technology. At minimum, the method includes the following steps: the step of forming a gate electrode on a substrate by using a light-intercepting material; of forming a gate insulating film on the substrate including the gate electrode; of forming a semiconductor layer on the gate insulating film; and of forming a source region and a drain region by virtue of the fact that light, having a wavelength such that the light is absorbed into the semiconductor layer while not being absorbed into the substrate, is irradiated from the back of the substrate, before supplying impurities into the semiconductor layer.

REFERENCES:
patent: 4459739 (1984-07-01), Shepherd et al.
patent: 4619034 (1986-10-01), Janning
patent: 4624737 (1986-11-01), Shimbo
patent: 4650524 (1987-03-01), Kiyama et al.
patent: 4700458 (1987-10-01), Suzuki et al.
patent: 4727044 (1988-02-01), Yamazaki
patent: 4733284 (1988-03-01), Aoki
patent: 4746628 (1988-05-01), Takafuji et al.
patent: 4849797 (1989-07-01), Ukai
patent: 4859908 (1989-08-01), Yoshida et al.
Sugioka et al., "Direct Formation of Three-Dimensional Strutures in GaAs by Excimer Laser Doping", Jap. J. Appl. Phys., vol. 28, No. 10, Oct., 1989, pp. 2162-2166. 1989.
Pressley, "Gas Immersion Laser Diffusion (GILDing), from Laser Processing of Semiconductor Devices", C.C. Tang, ed., Proc. SPIE, vol. 385, 1983, pp. 30-31. 1983.

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