1983-10-11
1986-03-04
Larkins, William D.
357 65, 357 68, 357 75, 357 76, 357 80, H01H 2336, H01H 2314
Patent
active
045742995
ABSTRACT:
A thyristor packaging system utilizes structured metal, strain buffers to provide paths of high electrical and thermal conductivity from the anode and cathode of a thyristor to power conductors connected to the anode and the cathode, such strain buffers each comprising a bundle of substantially parallel, closely packed strands of metal wire.
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Glascock, II Homer H.
Neugebauer Constantine A.
Webster Harold F.
Davis Jr. James C.
General Electric Company
Lamont John
Larkins William D.
Rafter John R.
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