Face on face flip chip integration

Details Face on face flip chip integration Face on face flip chip integration

1997-01-31

2000-05-02

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257777, 257778, H01L 2334

Patent

active

060575980

ABSTRACT:
The present invention provides methods and apparatus capable of efficiently combining a logic circuit die with a memory circuit die in a single integrated circuit device capable of supporting memory intensive applications, such as 3-dimensional graphics rendering, encryption and signal processing. The logic circuit die is produced independently with a logic circuit fabrication process that optimizes the logic circuit's performance and reduces costs, and the memory circuit die, which may contain a large memory circuit, can be produced independently with a memory circuit fabrication process that optimizes the memory circuit's performance and reduces costs. The circuit dies are attached directly together in a flip-chip fashion to create a unitary integrated circuit assembly having a high-performance, low impedance, wide-word interface. This integrated circuit assembly can be enclosed within a typical integrated circuit package for insertion on a circuit board, such as those used in personal computers and other common electronic applications.

REFERENCES:
patent: 5773896 (1998-06-01), Fujimoto et al.
patent: 5777345 (1998-07-01), Loder et al.
Gwennap, Linley, "NeoMagic Puts Graphics System in One Chip," Microprocessor Report, Mar. 6, 1995, pp. 20-21.
"Introduction to SmartMUMPs," EDT, Jul. 3, 1996.
D'Ignazio, John et al., "Assembly & Packaging News," prior to Nov. 30, 1996 .

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