Method for the production of flip-chip mounting-ready contacts o

Details Method for the production of flip-chip mounting-ready contacts o Method for the production of flip-chip mounting-ready contacts o

1998-06-22

2000-05-02

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438108, 438127, 438613, 438614, 438615, 22818021, 22818022, H01L 2144

Patent

active

060572221

ABSTRACT:
Contacts of SAW components are produced which are suitable for flip-chip mounting. Electrically conductive structures on a substrate are tightly encapsulated within a cover and contact pads of the electrically conductive structures are exposed in a window formed in the cover. Solderable layers are vapor deposited onto the contact pads of the electrically conductive structures after the cover is produced.

REFERENCES:
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 5172212 (1992-12-01), Baba
patent: 5329068 (1994-07-01), Hirata et al.
Japanese Patent Abstract No. 58047433 (Masanori), dated Sep. 29, 1984.

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