Method of packaging a semiconductor chip in a low inductance pac

Details Method of packaging a semiconductor chip in a low inductance pac Method of packaging a semiconductor chip in a low inductance pac

1991-04-23

1992-04-21

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29854, H05K 330, H01L 3902

Patent

active

051055368

ABSTRACT:
A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.

REFERENCES:
patent: 3218524 (1965-11-01), Reintgen et al.
patent: 3576474 (1971-04-01), Huber et al.
patent: 3740619 (1973-06-01), Rosvold
patent: 3919709 (1975-11-01), Koenig
patent: 3972062 (1976-07-01), Hopp
patent: 4070688 (1978-01-01), Wislocky
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4614836 (1986-09-01), Carpenter et al.
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4845545 (1989-07-01), Abramowitz et al.
Reeber, "Via Joint with Reduced Thermal Gradients", IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, pp. 563 and 564.
Denning, "Improved Contact Means for Multi-Emitter Power Transistors", RCA Technical Notes, TN No. 851, Mailed Oct. 16, 1969, pp. 1-3.

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