Method of using erodable masks to produce partially etched struc

Details Method of using erodable masks to produce partially etched struc Method of using erodable masks to produce partially etched struc

1989-12-27

1990-09-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 156657, 1566611, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

049575929

ABSTRACT:
The thermal ink jet silicon wafer printhead is formed in a single etching operation by partially etching into one portion of the wafer while at the same time completely etching through another portion of the wafer. An erodable mask layer is used to delay etching of partially etched regions in the wafer, the depth of the etching being defined by the etch time after the removal of the erodable masking layer, or by the V-groove termination as determined by via opening.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4455192 (1984-06-01), Tamai
patent: 4683646 (1987-08-01), Kando et al.
patent: 4810557 (1989-03-01), Blonder
patent: 4863560 (1989-09-01), Hawkins
patent: 4875968 (1989-10-01), O'Neill et al.
patent: 4899178 (1990-02-01), Tellier

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