Process of forming conductive bumps on the electrodes of semicon

Details Process of forming conductive bumps on the electrodes of semicon Process of forming conductive bumps on the electrodes of semicon

1995-10-30

1997-07-22

Ramsey, Kenneth J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

437183, 22818022, H01L 2144

Patent

active

056506678

ABSTRACT:
A method and structure for electrical contact bumps on a semiconductor die. Contact bumps are formed on the electrode contacts of an integrated circuit, then the surface of the semiconductor is coated with a protective polymer layer, and the layer is wafer lapped to produce contact bumps of uniform height.

REFERENCES:
patent: 4442967 (1984-04-01), van de Pas et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5058798 (1991-10-01), Yamazaki et al.
patent: 5060843 (1991-10-01), Yasuzato et al.
patent: 5550405 (1996-08-01), Cheung
T. Ohashiwa, et al., "Reflowable Sn-Pb Bump Formation on Al Pad by a Solder Bumping Method," IEEE, 1995, pp. 1203-1208.

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