Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-10-29
1995-04-25
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 522, 437206, 437207, 437208, H01R 4300
Patent
active
054087414
ABSTRACT:
The exposed portions of the leads of a semiconductor chip package are first bent in a forming process so that the ends of the leads are in proper positions to be attached to and electrically connected to contacts on a printed circuit board. Intermediate portions of the leads between the distal ends and the package body for connection to the printed circuit board and the package body are enclosed and fixed in position by a carrier body to hold the leads in position and to reduce the effects of any bending in destroying the coplanarity of the distal lead ends of the package. The package with the carrier body may be mounted onto the printed circuit board without first removing the carrier body. After the distal ends of the leads have been soldered to the printed circuit board, the carrier body is then removed.
REFERENCES:
patent: 3219748 (1965-11-01), Miller
patent: 4460825 (1984-07-01), Haghiri-Tehrani et al.
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4706811 (1987-11-01), Jung et al.
patent: 4707725 (1987-11-01), Ito
patent: 4746392 (1988-05-01), Hoppe
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4829666 (1989-05-01), Haghiri-Tehrani et al.
patent: 4837184 (1989-06-01), Lin et al.
patent: 4855807 (1989-08-01), Yamaji et al.
patent: 4897602 (1990-01-01), Lin et al.
IBM Technical Disclosure Bulletin vol. 29 No. 6 Nov. 1986 pp. 2486-2487.
Arbes Carl J.
VLSI Technology Inc.
LandOfFree
Method for forming electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming electronic device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1559934