Process for the production of fine structures consisting of a va

Details Process for the production of fine structures consisting of a va Process for the production of fine structures consisting of a va

1975-07-08

1978-08-22

Smith, John D.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

96 362, 156657, 156664, 156665, 204192R, 427 88, 427 89, 427 90, 427 91, 427 96, 427124, 427150, 427259, 427282, B05D 512

Patent

active

041087178

ABSTRACT:
A process for producing fine structures having an order of magnitude of 1 .mu.m without a loss of dimension relative to a mask on a base such as a semiconductor device having electrode structures characterized by providing a base having a surface which is either etchable or is provided with an auxiliary etchable layer, providing a mask on the surface, which mask has openings corresponding to the fine structure of material to be applied on the surface, providing an etching agent which attacks the surfaces of the base without attacking the mask, etching the uncovered portions of the base until an under-etching of predetermined width exists beneath the edges of the mask, depositing the layer of material on the entire surface, controlling the amount of depositing so the layer of material being deposited on the mask and on the etched surfaces of the base are not in contact with each other, and subsequently removing the mask with the layer of material deposited thereon. If an auxiliary layer is on the surface it may be subsequently removed by etching without substantially etching the deposited fine structure or it may be retained to provide closely spaced electrode patterns. If the auxiliary layer is to be removed, it is of a material such as a metal alloy that can be selectively etched without damage to the material or metal deposited as the fine structure.

REFERENCES:
patent: B316014 (1975-01-01), Dean
patent: 3700510 (1972-10-01), Keene et al.
patent: 3839111 (1974-10-01), Ham et al.
patent: 3873361 (1975-03-01), Franco et al.
patent: 3927418 (1975-12-01), Ando et al.
Duffek et al., "Printed Circuit Board Etch Characteristics", Metal Finishing, 10-68.
G. Bergasse, "IBM Technical Disclosure Bulletin", vol. 16, No. 7, Dec. 1973.

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