Low-profile socketed packaging system with land-grid array and t

Details Low-profile socketed packaging system with land-grid array and t Low-profile socketed packaging system with land-grid array and t

1996-10-03

1997-10-14

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, H01L 2160

Patent

active

056772475

ABSTRACT:
A socketed integrated circuit packaging system, including a packaged integrated circuit and a socket therefor, is disclosed. The integrated circuit package includes a device circuit board to which a thermally conductive slug is mounted; the underside of the device circuit board has a plurality of lands arranged in an array. The integrated circuit chip is mounted to the slug, through a hole in the device circuit board, and is wire-bonded to the device circuit board and thus to the lands on the underside. The socket is a molded frame, having a hole therethrough to receive the conductive slug of the integrated circuit package; the socket may also have its own thermally conductive slug disposed within the hole of the frame. The socket has spring contact members at locations matching the location of the lands on the device circuit board. The integrated circuit package may be inserted into the socket frame, held there by a metal or molded clip. A low profile, low cost, and high thermal conductivity package and socket combination, is thus produced.

REFERENCES:
patent: 3795884 (1974-03-01), Kotaka
patent: 4190879 (1980-02-01), Tissot
patent: 4688151 (1987-08-01), Kraus
patent: 5280409 (1994-01-01), Selna
patent: 5282111 (1994-01-01), Hopfer
patent: 5298686 (1994-03-01), Bourdelaise
patent: 5309324 (1994-05-01), Hernandez
patent: 5557504 (1996-09-01), Siegel et al.
patent: 5570273 (1996-10-01), Siegel et al.

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