Patent
1989-03-31
1991-02-05
James, Andrew J.
357 70, H01P 508, H01L 2350, H01L 2160
Patent
active
049910019
ABSTRACT:
There is disclosed a mounting structure for a semiconductor integrated circuit device or IC device having signal transmission terminals, which has an insulative substrate on which the IC device is mounted, a conductive signal transmission wiring line formed on the substrate and electrically connected to a selected one of the signal transmission terminals of the IC device, and an insulative resin layer formed on the substrate to at least partially cover the signal transmission wiring line. The insulative resin layer functions to change and set the impedance of the signal transmission wiring line to a desired impedance value. The insulative resin layer is formed to have a selected thickness such that the characteristic impedance of the wiring line, which tends to fluctuate in the wiring line etching formation process, can be adjusted and set towards a destination characteristic impedance.
REFERENCES:
patent: 3975690 (1976-08-01), Fleming
patent: 4543544 (1985-09-01), Ziegner
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4626889 (1986-12-01), Yamamoto et al.
patent: 4724409 (1988-02-01), Lehman
patent: 4806892 (1989-02-01), Thorpe et al.
patent: 4949163 (1990-08-01), Sudo et al.
Derwent Publications, EP-293,838, Dec. 1988.
Saito Kazutaka
Sudo Toshio
Takubo Chiaki
James Andrew J.
Kabushiki Kaisha Toshiba
Nguyen Viet Q.
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