Manufacture of semiconductor device containing polycide electrod

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438632, 438648, H01L 2144

Patent

active

058343709

ABSTRACT:
An element including a polycide electrode is formed on a silicon substrate, and after a BPSG film is deposited as an interlevel insulating film and a contact hole is formed therein, the substrate is lamp annealed in an atmosphere containing oxygen to reflow the BPSG film. After an HF process, an Al wiring is formed on the BPSG film, contacting the polycide electrode via the contact hole. It is possible to prevent an increase in the contact resistance of the polycide electrode.

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patent: 5322812 (1994-06-01), Dixit et al.
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patent: 5449640 (1995-09-01), Hunt et al.
patent: 5506177 (1996-04-01), Kishimoto et al.
patent: 5578522 (1996-11-01), Nakamura et al.

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