Multi-layer structure for II-VI group compound semiconductor on

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Implanting to form insulator

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148 334, 148 335, 148DIG64, 148DIG169, 257 12, 257 78, 438509, H01L 21363, H01L 2922

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058343610

ABSTRACT:
In a method of forming a II-VI compound semiconductor thin film on an InP substrate, a layer of III-V compound semiconductor mixed crystal is first formed on the InP substrate. The desorption rate of a group V element constituting the III-V compound semiconductor mixed crystal at a decomposition temperature of a native oxide layer formed on a surface of the III-V compound semiconductor mixed crystal layer is lower than a desorption rate of P of the InP substrate at a decomposition temperature of a native oxide layer formed on a surface of the InP substrate. A II-VI compound semiconductor thin film layer is formed on the first III-V compound semiconductor mixed crystal layer.

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