Method and apparatus for producing variable spatial frequency co

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156657, 156662, 156345, B44C 122, H01L 21306, C03C 1500

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active

052924009

ABSTRACT:
A reactor 10 having a vacuum housing 30 which encloses a plurality of plasma chambers 14a, 14b is used to perform local plasma assisted chemical etching on an etchable substrate 12. The chambers 14a, 14b are movable and are sized according to the removal material footprint desired. Radio frequency driven electrodes 20a, 20b and gas diffuser/electrodes 22a, 22b have the same diameter as the chambers 14a, 14b. The substrate 12 is mounted on a substrate holder 44 which also acts as the other electrode. The holder 44 is mounted on an X-Y positioning table 46. A process gas is flowed into a preselected chamber with rf power so as to disassociated the process gas into a plasma. The plasma chambers 14a, 14b may be scanned over the substrate surface while the gap between the chambers and the substrate is varied to yield a desired etch profile.

REFERENCES:
patent: 4411733 (1983-10-01), Macklin et al.
patent: 4482419 (1984-11-01), Tsukada et al.
patent: 4680086 (1987-07-01), Thomas et al.
patent: 4964940 (1990-10-01), Auvert et al.
patent: 5009738 (1991-04-01), Gruenwald et al.

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