Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent
1994-11-29
1996-10-01
Ngo, Ngan V.
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
257306, 257308, 257311, 257905, 257908, H01L 27108, H01L 2976, H01L 2994, H01L 31119
Patent
active
055613110
ABSTRACT:
A semiconductor memory having memory cells is formed on a semiconductor substrate. Each of the memory cells has a transistor and a capacitor. The transistor includes a channel region, a drain region and a source region aligned in a line and being insulated by an insulation film from an adjacent cell. Each of the memory cells has a gate electrode formed on the channel region with a gate insulating film therebetween. A pad electrode makes electrical contact with one of the source and drain regions of the memory cell and extends over the insulation film. A bit line makes electrical contact with the pad electrode above, extends in parallel to the line and is laterally isolated from one of the source and drain regions. A first insulating film is formed on the semiconductor substrate over the bit line. A first capacitor electrode is formed on the first insulating film, making electrical contact with the other of the source and drain regions of the memory cell through a contact hole opened through the first insulating film and insulated from the bit line by the first insulating film. A second capacitor electrode is formed on the first capacitor electrode with a second insulating film provided therebetween. The insulation film is embedded in a groove formed on the semiconductor substrate.
REFERENCES:
patent: 4784492 (1988-05-01), Iwase et al.
patent: 4799093 (1989-01-01), Kohara et al.
patent: 4816423 (1989-03-01), Havemann
patent: 4970564 (1990-11-01), Kimura et al.
patent: 5012310 (1991-04-01), Kimura et al.
patent: 5055420 (1991-10-01), Ikeda et al.
patent: 5235199 (1993-04-01), Hamamoto et al.
Kinney et al., "A Non-Volatile Memory Cell Based on Ferroelectric Storage Capacitors", IEEE 1987, pp. 850-851.
Koyanagi et al., "Novel High Density, Stacked Capaitor MOS RAM", Japanese Journal of Applied Physics, vol. 18 (1979) Supplement 18-1, pp. 35-42.
Bell et al., "SIPMOS Technology, an Example of VLSI Precision Realized with Standard LSI for Power Transistors", Siemens Forsch.-u. Entwickl.-Ber. Bd., 9 (1980) Nr. 4, pp. 190-194.
Hamamoto Takeshi
Hieda Katsuhiko
Horiguchi Fumio
Kabushiki Kaisha Toshiba
Ngo Ngan V.
LandOfFree
Semiconductor memory with insulation film embedded in groove for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor memory with insulation film embedded in groove for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory with insulation film embedded in groove for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1503637