Bonding pad scheme

Details Bonding pad scheme Bonding pad scheme

1987-12-18

1991-02-05

James, Andrew J.

357 70, 357 74, 357 65, H01L 2348

Patent

active

049909967

ABSTRACT:
A technique is disclosed for manufacturing an integrated circuit die which is capable of being packaged in any of two or more different package types having different arrangements of bonding posts. The circuit is laid out with redundant pads located at different places on the die so that one pad in each pair of redundant pads is accessible for bonding with posts in one package type, while the other pad in each pair of redundant pads is accessible for bonding with posts in another package type. Illustrative layouts are shown whereby various types of pads, e.g., power pads, signal input pads, signal output pads and bidirectional I/O pads, may be made redundant.

REFERENCES:
patent: 4688070 (1987-08-01), Shiotari
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 4934820 (1990-06-01), Takahashi et al.

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