Photoresist formulations

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430286, 430315, 430319, 430525, 430920, 427 96, 427 98, 148 614R, H05K 318

Patent

active

042686105

ABSTRACT:
Photoresist compositions with improved adhesion properties are provided for use in making printed circuit boards, lithographic plates, relief image plates or cylinders and for other applications in the graphic arts. The subject invention also provides for methods and photoresist elements utilizing the photoresist compositions. The photoresist compositions include, in addition to a photopolymerizable compound, a photo initiator, a polymeric binder, and other optional additives and N-substituted benzotriazoles which serve as improved adhesion promoters.

REFERENCES:
patent: 3622334 (1971-11-01), Hurley et al.
patent: 3645772 (1972-02-01), Jones

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoresist formulations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist formulations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist formulations will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1490557

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.