Method to deposit highly conformal CVD films

Details Method to deposit highly conformal CVD films Method to deposit highly conformal CVD films

1995-06-07

1997-06-24

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427582, 427583, 427588, 427 97, 427 99, 4272481, 4272551, 4272553, C23C 1648

Patent

active

056415451

ABSTRACT:
A method for chemical vapor deposition onto high aspect ratio features. Process gases including a reactant species are supplied to the surface and sufficient primary energy is supplied to the surface so as to cause the reactant species to deposit on the surface. Additional energy is supplied, preferably in the form of optical energy, that is tuned to be captured by the patterned features so as to slow the deposition rate preferentially on the patterned features.

REFERENCES:
patent: 4699801 (1987-10-01), Ito et al.
patent: 4849260 (1989-07-01), Kusumoto et al.
patent: 4872947 (1989-10-01), Wang et al.
patent: 5290358 (1994-03-01), Rubloff et al.
patent: 5393577 (1995-02-01), Uesugi et al.
patent: 5462767 (1995-10-01), Yamazaki et al.

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