Silicone die attach adhesive, method for the fabrication of semi

Details Silicone die attach adhesive, method for the fabrication of semi Silicone die attach adhesive, method for the fabrication of semi

1997-04-09

1999-11-09

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

438118, 438119, 156329, 428447, 528 31, H01L 2158, H01L 2348, C09J 400, B32B 904

Patent

active

059820411

ABSTRACT:
A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane.
Also, a fabrication method characterized by

REFERENCES:
patent: 4426240 (1984-01-01), Louis et al.
patent: 5145931 (1992-09-01), Nakayoshi et al.
patent: 5173765 (1992-12-01), Nakayoshi et al.
patent: 5789516 (1998-08-01), Graiver et al.
patent: 5804631 (1998-09-01), Mine et al.

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