Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1997-06-27
1999-11-09
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438124, 438126, 438127, H01L 2144, H01L 2148, H01L 2150
Patent
active
059813121
ABSTRACT:
The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
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Farquhar Donald Seton
Klodowski Michael Joseph
Papathomas Konstantinos
Wilcox James Robert
Hogg William N.
International Business Machines - Corporation
Jones Josetta I.
Niebling John F.
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