Method of sticking semiconductor wafer and its sticking device

Details Method of sticking semiconductor wafer and its sticking device Method of sticking semiconductor wafer and its sticking device

1997-03-26

1998-12-15

Kramer, Dean

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

1565833, 294 641, 29743, 414941, B65G 4907

Patent

active

058491392

ABSTRACT:
A method of sticking a semiconductor wafer and its sticking equipment. The semiconductor wafer can be flat and efficiently stuck on a plate. The semiconductor wafer, which has its inner surface coated with an adhesive, is tiltedly configured to permit raising a circumference to a height of Ah and located the wafer above a sticking position on the plate. The semiconductor wafer is pressed by a lower end of a stamp-press to be parallel to a surface of the plate. Then a vacuum chuck (2) stops sucking to release the semiconductor wafer from a transporting arm, and the transporting arm is moved away. The stamp-press is moved downward to press a whole surface of the semiconductor wafer.

REFERENCES:
patent: 4778332 (1988-10-01), Byers et al.
patent: 4904012 (1990-02-01), Nishiguchi et al.
patent: 4960485 (1990-10-01), Ichinose et al.
patent: 5232532 (1993-08-01), Hori
patent: 5685588 (1997-11-01), Wong et al.

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