Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-09-28
1986-07-08
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118 501, 118620, 118730, 156345, 156657, 204192EC, 204192E, 204298, 427 38, B44C 122, C03C 1500, B05D 306, C23C 1400
Patent
active
045991359
ABSTRACT:
In a thin film deposition apparatus, means for depositing a film on a substrate and means for etching the deposited film to make flat the surface thereof, are provided in a reaction vessel independently of each other. This apparatus can rapidly deposit the film without rising the temperature of the substrate excessively. Further, since the deposition means and etching means are independent of each other, the deposition of a film on the substrate and the planarization of the surface of the deposited film can be achieved under various conditions.
REFERENCES:
patent: 3563809 (1971-02-01), Wilson
ECS Abstract, No. 148, 1982, pp. 233-234, Low Temperature Deposition Apparatus Using An Electron Cyclotron Resonance Plasma, Matsuo et al.
Ionics, Aug. 1981, pp. 1-10, T. Yaita.
IBM Technical Disclosure Bulletin, vol. 21, No. 11, Apr. 1979, Platinum Contact/Chromium Barrier Metallurgical Processing Technique by Ion Milling, Gartner et al., pp. 4503-4504.
Hom-ma Yoshio
Morisaki Hiroshi
Mukai Kiichiro
Okudaira Sadayuki
Tsunekawa Sukeyoshi
Hitachi , Ltd.
Powell William A.
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