Method for improving the surface insulation resistance of printe

Details Method for improving the surface insulation resistance of printe Method for improving the surface insulation resistance of printe

1992-02-11

1993-06-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 1566591, 156666, 156668, 156902, B44C 122, C23F 100, B29C 3700

Patent

active

052214184

ABSTRACT:
After the etching away of copper to selectively expose surface areas of insulating resin material in a printed circuit process based upon metal-clad insulating substrate material, the exposed surface areas of insulating material are contacted with a liquid treatment composition effective to soften or swell the resin material such that residual metal species otherwise associated with the surface area are removed or, at the least, become entrapped or encapsulated below a surface of resin, such that the surface insulation resistance afforded by the insulating surface areas of the printed circuit is improved.

REFERENCES:
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patent: 4515829 (1985-05-01), Deckert et al.
patent: 4592852 (1986-06-01), Courduvelis et al.
patent: 4597988 (1986-07-01), Kukanskis et al.
patent: 4601783 (1986-07-01), Krulik
patent: 4601784 (1986-07-01), Krulik
patent: 4629636 (1986-12-01), Courduvelis et al.
patent: 4756930 (1988-07-01), Kukanskis et al.
patent: 4978422 (1990-12-01), Letize et al.
patent: 5032427 (1991-07-01), Kukanskis et al.

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