Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-12-08
1982-08-24
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156643, 156656, 156657, 1566591, 156668, 427259, 427336, H01L 2170
Patent
active
043461255
ABSTRACT:
In an integrated circuit fabrication sequence, a hardened mask pattern adhered to an underlying substrate is removed from the substrate by a solvent that comprises anhydrous hydrazine and dimethyl sulfoxide. The solvent rapidly penetrates the interface between the pattern and the underlying substrate and quickly breaks the adhesive bonds therebetween. Other materials (e.g., Al, Si, SiO.sub.2) in the structure being fabricated are not deleteriously affected by the solvent.
REFERENCES:
patent: 3873361 (1975-03-01), Franco et al.
patent: 4218283 (1980-08-01), Saiki et al.
patent: 4238528 (1980-12-01), Angelo et al.
Audrieth et al., "Non-Aqueous Solvents", pp. 129-134, John Wiley & Sons, Inc., N.Y., .COPYRGT.1953.
Moran et al., "High Resolution, Steep Profile, Resist Patterns", The Bell System Technical Journal, May-Jun. 1979, vol. 58, No. 5.
Hom-ma et al., "A New Lift-Off Metallization Technique for High Speed Bipolar LSI's", Central Research Laboratory, Hitachi, Ltd., Japan, .COPYRGT.1979, IEEE.
Kinsbron Eliezer
Vratny Frederick
Bell Telephone Laboratories Incorporated
Canepa Lucian C.
Smith John D.
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