Photoresist and redeposition removal using carbon dioxide jet sp

Details Photoresist and redeposition removal using carbon dioxide jet sp Photoresist and redeposition removal using carbon dioxide jet sp

1996-10-04

1998-12-29

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Finishing or perfecting composition or product

430329, 134 72, 134201, 134902, G03C 500, B08B 300

Patent

active

058539620

ABSTRACT:
A method of removing photoresist or redeposited material from a substrate or other surface using a carbon dioxide jet spray. A substrate having photoresist or redeposited material on its surface is disposed in an environmental enclosure. A carbon dioxide jet spray is generated and directed onto the surface of the substrate and photoresist or redeposited material. The carbon dioxide jet spray cools or freezes the material and causes a mismatch in the thermal coefficient of expansion of the material and the substrate. The material debonds from the substrate due to the induced thermal shock to the material. This rapid shrinkage loosens the material and allows the solid particles in the spray to knock the material from the surface of the substrate. The removed photoresist or redeposited material may be collected in a filter, and removed.

REFERENCES:
patent: 4747421 (1988-05-01), Hayashi
patent: 5125979 (1992-06-01), Swain et al.
patent: 5315793 (1994-05-01), Peterson et al.
patent: 5378312 (1995-01-01), Gifford et al.
patent: 5766061 (1998-06-01), Bowers
patent: 5766368 (1998-06-01), Bowers

Affiliated with

Also associated with

Rating

Photoresist and redeposition removal using carbon dioxide jet sp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist and redeposition removal using carbon dioxide jet sp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist and redeposition removal using carbon dioxide jet sp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1423082