Process for producing multilayer ceramic circuit board with copp

Details Process for producing multilayer ceramic circuit board with copp Process for producing multilayer ceramic circuit board with copp

1985-11-26

1987-07-14

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 156 89, H01K 322

Patent

active

046793208

ABSTRACT:
A process for producing a multilayer ceramic circuit board with copper including the steps of:
forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.

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IBM Tech Disclosure Bull, vol. 12, No. 1, Jun. 1978, p. 171, by Miller.
IBM Tech Disclosure Bull, vol. 22, No. 4, Sep. 1979, p. 1542, by Master et al.

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