Method of making overpass mask/insulator for local interconnects

Details Method of making overpass mask/insulator for local interconnects Method of making overpass mask/insulator for local interconnects

1994-05-19

1996-03-05

Fourson, George

Fishing, trapping, and vermin destroying

437235, 437236, 437195, 437 40, H01L 2144, H01L 2148

Patent

active

054967716

ABSTRACT:
Fabrication methods and resultant semiconductor structures wherein stack structures are selectively insulated from an enveloping layer of local interconnect material. The fabrication methods involve forming an overpass insulator(s) simultaneously with the underlying gate. Specifically, a layer of non-erodible insulating material is deposited over a layer of conductive material roughly in the area to comprise the stack structure. A simultaneous etch is then performed, and the resultant insulator portion is self-aligned to the underlying conductive material. The insulator portion insulates the stack from a subsequently deposited and planarized layer of local interconnect. Further processing options include decoupling silicide formation on selected stack structures, and various planarization and etching approaches for different available technologies. Specific details of the fabrication methods and resultant structures are set forth.

REFERENCES:
patent: 4505030 (1985-03-01), Jeuch
patent: 4789648 (1988-12-01), Chow et al.
patent: 4808552 (1989-02-01), Anderson
patent: 4933743 (1990-06-01), Thomas et al.
patent: 4944836 (1990-07-01), Beyer et al.

Affiliated with

Also associated with

Rating

Method of making overpass mask/insulator for local interconnects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making overpass mask/insulator for local interconnects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making overpass mask/insulator for local interconnects will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1412843