Particle contamination apparatus for semiconductor wafer process

Details Particle contamination apparatus for semiconductor wafer process Particle contamination apparatus for semiconductor wafer process

1994-07-18

1996-03-05

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

156345, 20429801, 20429807, 20429831, 20429833, 20429841, C23C 1600, C23C 1400, C23F 102

Patent

active

054964091

ABSTRACT:
A semiconductor wafer processing system is disclosed which reduces particle accumulations in the wafer loading chamber during the pump down and vent cycle. A separate venting tube is provided which is positioned within the roughing tube used for the pump-down cycle. The venting tube is isolated from particulate matter which may be present in the roughing tube so that venting gas flow does not cause re-entry of the residual particulate matter into the loading chamber. The venting tube can be easily and inexpensively installed as a particle reduction kit into existing wafer processing systems.

REFERENCES:
patent: 4340568 (1982-07-01), Hirai
patent: 4911597 (1990-03-01), Maydan
patent: 5043299 (1991-08-01), Chang
patent: 5070814 (1991-12-01), Whiffin
patent: 5160543 (1992-11-01), Ishihara
patent: 5223001 (1993-06-01), Saeki
patent: 5292393 (1994-03-01), Maydan
patent: 5336029 (1994-08-01), Kato
patent: 5387289 (1995-02-01), Schmitz

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