Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-08-03
1990-07-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156655, 1566591, 156662, 350 9612, 357 16, 437126, 437725, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
049448382
ABSTRACT:
Adiabatic mode control and structural reproducibility are achieved by a tapered semiconductor waveguide structure wherein semiconductor guiding layers are interleaved with stop-etch layers and each guiding layer extends further along the propagation axis of the waveguide further than the guiding layer immediately adjacent thereabove to create a staircase-like core or guiding structure. Cladding regions of appropriate semiconductor material having a lower index of refraction than the tapered core structure may be added to completely surround the tapered guiding structure. The profile of the tapered structure is realizable as any desired staircase-like shape such as linear, parabolic, exponential or the like. Additional layers of higher index of refraction semiconductor material may be included in the cladding region to permit additional beam shaping of the expanded spatial mode propagating along the tapered waveguide.
Photolithographic masks defining successively larger exposed areas are aligned, deposited over the waveguide structure, and then removed following each etching step. Material selective etching techniques are employed to remove exposed (unmasked) portions of guiding layers. In sequence, the exposed, formerly underlying portions of the stop-etch layers are then removed using material selective etching. Iteration of the above process steps permits a tapered waveguide structure to be defined.
REFERENCES:
patent: 3978426 (1976-08-01), Logan et al.
patent: 3993963 (1976-11-01), Logan et al.
patent: 4354898 (1982-10-01), Coldren et al.
patent: 4622674 (1986-11-01), Mito
patent: 4656636 (1987-04-01), Amann et al.
patent: 4662988 (1987-05-01), Renner
Tien et al., Applied Optics, vol. 12, No. 8, Aug. 1973, "Formation of Light-Guiding Interconnection . . . ", pp. 1909-1916.
Merz et al., Appl. Phys. Lett., vol. 26, No. 6, Mar. 15, 1979, "Taper Couplers for GaAs-Al.sub.x Ga.sub.1-x As Waveguide Layers . . . ", pp. 337-341.
Milton et al., IEEE J. of Quan. Elec., vol. QE-13, No. 10, Oct. 1977, "Mode Coupling in Optical Waveguide Horns", pp. 828-835.
Elliott et al., IEE Colloquim on Towards Semiconductor Integ. Optoele., Dig. No. 29, Nov. 1-4, 1985, "Photoelectrochemical Etching of . . . ", pp. 11/1-11/4.
Cox et al., J. of Lightwave Tech., vol. 6, No. 6, Jun. 1988, "Development of Tapered Glass Coupling . . . ", pp. 1045-1050.
Koch Thomas L.
Koren Uziel
AT&T Bell Laboratories
Powell William A.
Ranieri Gregory C.
LandOfFree
Method of making tapered semiconductor waveguides does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making tapered semiconductor waveguides, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making tapered semiconductor waveguides will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1397279