Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1996-10-10
1998-06-23
Dutton, Brian
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438669, 438720, 438926, H01L 214763, H01L 21302
Patent
active
057705186
ABSTRACT:
Undercutting of conductive lines in a dense array on a dielectric layer containing an open field is prevented by providing one or more non-functional components, such as one or more non-functional conductive lines, in the dielectric layer under the dense array of conductive lines.
REFERENCES:
patent: 4916514 (1990-04-01), Nowak
patent: 5182235 (1993-01-01), Eguchi
patent: 5441915 (1995-08-01), Lee
patent: 5459093 (1995-10-01), Kuroda et al.
patent: 5476817 (1995-12-01), Numata
patent: 5500076 (1996-03-01), Jerbic
Advanced Micro Devices , Inc.
Dutton Brian
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