Method for packaging semiconductor dice

Details Method for packaging semiconductor dice Method for packaging semiconductor dice

1995-12-01

1997-01-14

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437215, 437217, H01L 2160

Patent

active

055939279

ABSTRACT:
A method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die. The die is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive traces. The protective layer is formed as a thin or thick film of an electrically insulating material such as a polymer, glass, nitride or oxide. In addition, the protective layer can be formed with a tapered peripheral edge to facilitate insertion of the die into the die holder.

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